Sesame Laser

Sesame Laser

Product Highlight

DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP).

  • After 15 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …). 
  • The SLP500DC is based on our SL500DC platform.  It combines a high performance IR Fiber LASER with an Atmospheric Plasma Assisted to avoid corrosion. This SLP is based on our joint patent with the CNES Toulouse (Fr) – WO 2008/090281.

SLP500DC Platform

  • 3 in 1 system: The SLP500 allows to perform IC decapsulator, PCB cutting, samples cross-section

  • Flexible and Reliable : The SLP50 integrates a 20W IR Fiber LASER on basis. Laser or Lens upgrades are available to meet all you requirements. The SLP500 is equipped with a Live vision camera with Fast Z adjustment and a Coaxial camera with High Mag and FOV on request.

  • Easy and Safe: The SLP500 is a compact system, very easy to move. It can be installed everywhere in a workshop or on a production line and  needs a simple mono-phased electric plug 110/220V – 50/60Hz. Plug it, you are ready to start

  • Many Options available: Motorized table, Multipulse LASER …

SLP500DC, THE FLEXIBILITY TO SUIT YOUR APPLICATION

Specifications

  • Laser ablation area up to 170x170mm with the 254mm lens
  • Atmospheric Plasma AssistedTM to avoid corrosion
  • Compatible with Au, Al, Cu, Cu/Pd, Ag wires
  • Quick focus with its lateral camera
  • Real time vision during ablation
  • Wide choice of FOV
  • Easy to use with its 2 intuitive software: Basic and Expert
  • Precise decapsulation using Xray and SAM images
  • Design your own gasket
  • Laser Cross-Section
  • Trought Galvo-Head Camera
  • Small footprint and easy to move
  • X-Y motorized table : 50x50mm or 100x100mm
  • Fast upgrade on site
More informations