iMIP Decapsulation

• First and only qualified system to interface with patented decapsulation technology
• Etch rates for many compounds more than 1 mil per hour
• Fastest removal of epoxy and plastic molding materials
• Worldwide reduction of CFC’s and other chemicals typically used for cleaning / etching in wet processes … HNO₃ and H₂SO₄ … for IC DCap
• Environmentally friendly
• CE Certificate

Plasma is the only solution to many problems in DCapsulation for:

• Wire Bond:
  – Cu, PCC, Au, Al, Ag Wire
  – Fresh & Thermally Stressed
• Flipchip:
  – RDL
  – Cu Pillar, Solder Bump
  – Fan-in and Fan-out WLP
• Chip:
  – BOAC
  – GaAs, GaN
  – SAW, BAW
• Package:
  – 2.5/3D
  – PCB
  – SiP, CoWoS
• Failure Type:
  – EOS
  – Migration
  – Corrosion
  – Contamination
• Encapsulant:
  – High Tg
  – Glob Top
  – Underfill, DAF, FOW
  – Clear Mold, Die Coat