04/28/2015 DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP). After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …). The SLP500DC is based on our SL500DC…
03/18/2015 Digit Concept has been selected to participate to the Season 1 of the Fast Forward Normandie program and to accelerate his business development. More information … FFWD
11/01/2014
04/25/2013 The use of LASER systems for electronic chip access is becoming a well established technique. The method has been proven to be fast and can gain valuable results — especially on plastic packages. The LASER technique allows for ultra low temperature wet chemical final decapsulation and for reduced time with dry chemical (plasma) final…
03/19/2013 Digit Concept Asia will be pleased to introduce our equipment for failure analysis and plasma treatment at SEMICON China 2013. Come and visit us at the booth #2812.