Laser Chip Access
04/25/2013
The use of LASER systems for electronic chip access is becoming a well established technique. The method has been proven to be fast and can gain valuable results — especially on plastic packages. The LASER technique allows for ultra low temperature wet chemical final decapsulation and for reduced time with dry chemical (plasma) final decapsulation. The technique can be seen as a « Swiss knife » in many labs and many openings start with a LASER step today. This presentation also reviewed several case studies .