11/25/2015
Digit Concept will attend the 17th Electronics Packaging Technology Conference, that will take place in Singapor, 2-4 December, 2015.
All the DC Team we will be gald to meet you and to show you our last products.
If you have questions on Cu or Ag wires decapsulation, don’t hesitate to ask us our recipes, or meet us during the poster session the 4th of december, we will present a poster titled : New decapsulation methods for ICs with Cu and Ag wires.
04/28/2015 DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP). After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …). The SLP500DC is based on our SL500DC…
11/01/2014
07/7/2016 Digit Concept Asia Pacific will attend the 23rd International symposium on the Physical and Failure Analysis of integrated circuits (IPFA), that will take place in Marina Bay Sands, Singapore from 18th to 21th July 2016. All the DC Team we will be glad to meet you at our Booth A1-A3 and to show you our last products and…
04/16/2019 • SESAMEPLASMA™ – New ICEMIP for ESREF2018 • SESAMEACID™ – New ISA777 for ESREF2018 • SESAMELASER™ – New DeCap Software for ESREF2018 • SESAMELASER™ – New SL_MicroMachining before FIB for ESREF2018 • SESAMEMECHANICAL™ • SESAMETHERMAL™ • iPanel ™ UP-GRADE or TRADE-IN your old equipment with thelast technics … with … New iPanel™ and Options See our last researchpresented at IPFA, ISTFA, ESREF
10/1/2020 iSA: iPanel™ Sesame Acids The best Automated Decapsulation System we have designed. More …