IPFA2024 iMIP II XL™
07/16/2024

New for 2024 iMIP II XL™
Atmospheric DCapsulation of IC on Board.
Maximum size 300x300mm (12″x12″)
07/16/2024

New for 2024 iMIP II XL™
Atmospheric DCapsulation of IC on Board.
Maximum size 300x300mm (12″x12″)
12/13/2021 2021 December iMIP Release II More Green … … More options :).
11/01/2014
05/22/2025 We have show for the first time the results of DCapsulation with the new iMIP XL™ already installed at Customers Plants in 2024. This one allow to DCap a IC on large board (300x300mm). This is a World Premiere ;).
04/28/2015 DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP). After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …). The SLP500DC is based on our SL500DC…